• 01

    Acceptable

    Components may have minor flaws but remain functional.

  • 02

    AS6081

    Developed by SAE International, outlines rigorous practices to prevent substandard and counterfeit materials from entering the global supply chain. It provides systematic methods for avoiding, detecting, mitigating, and disposing of such materials.

  • 03

    AS6171

    Sets strict requirements, practices, and test methods for test facilities, surpassing previous standards for resellers (AS6081).

  • 04

    AS6496

    Mandates anti-counterfeiting policies and control plans for authorized distributors, focusing on the avoidance, detection, mitigation, and disposal of counterfeit products in the authorized distribution supply chain.

  • 05

    Bulk

    Bulk packaging refers to components packaged without special protection.

  • 06

    C of C

    Certificate of Conformity (C of C) verifies that components meet industry standards.

  • 07

    Carrier Tape

    Common packaging with component pockets, typically used with reels.

  • 08

    Desiccant

    Absorbs moisture to keep components dry

  • 09

    ESD

    Electrostatic Discharge (ESD) occurs when a static charge moves between objects with varying electrical potentials.

  • 10

    Falsified

    Intentional document alteration to change its original meaning.

  • 11

    Forged

    Counterfeit information created for components.

  • 12

    Fraudulent

    Components inconsistent with the seller's description.

  • 13

    HIC

    HIC (Humidity Indicator Card) helps estimate package humidity and desiccant effectiveness by changing dot color.

  • 14

    MBB

    MBB (Moisture Barrier Bag) is moisture-resistant and used with desiccants and HIC for added protection.

  • 15

    MSL

    MSL (Moisture Sensitivity Level) indicates a device's moisture protection requirements.

  • 16

    OCM

    OCM (Original Component Manufacturer) denotes the initial manufacturer of a component.

  • 17

    Preconditioning

    Involves baking or steaming, simulating aging and ensuring solderability.

  • 18

    Reels

    Wrap carrier tapes, streamlining automatic component assembly.

  • 19

    Shielding

    Protects ESD-sensitive devices from damage during handling.

  • 20

    Tape

    Cover safeguards components within carrier tapes.

  • 21

    Traceability

    Allows tracking of a component's part number and manufacturer.

  • 22

    Trays

    Store larger or delicate components, protecting them from damage.

  • 23

    Tubes

    Are used for various-shaped components, especially SMDs.

  • 24

    Unacceptable

    Components are unusable due to specific features or defects.

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